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SRWS-S SMD Rework System
SRWS Rework System provides full control over SMD components rework processes.
T210-A Precision Purpose Handle
The T210-A Precision Purpose Handle works exclusively with DI, DDE , DME, CD-SQ and CD-BQ.
T210-NA Nitrogen Precision Handle
The T210 Nitrogen Precision Iron allows creating an inert atmosphere, removing the oxygen, and hence minimizing oxidizing effect during solder joint formation.
T245-A General Purpose Handle
This soldering iron handle for general purposes is perfect for both SMD components and for jobs with high power requirements (e.g. ground plane soldering).
T245-NA Nitrogen Handle
The T245 Nitrogen Iron allows creating an inert atmosphere, removing the oxygen, and hence minimizing oxidizing effect during solder joint formation.
T470-FA Thermal Insulator HD Handle
This soldering iron handle is perfect for intensive soldering jobs requiring continued high thermal power such as large ground planes, production of solar panels, armor and other applications.
T470-NA Nitrogen HD Handle
The T470 Nitrogen Heavy Duty Iron allows creating an inert atmosphere, removing the oxygen, and hence minimizing oxidation.
Techform TC-533 Peelable Solder Mask
Kester peelable mask is a high-temperature flexible solder masking compound specially formulated of natural latex rubber. Prevent solder from flowing into contacts, terminals, screw heads and plated through holes.
Tip Shields
Reusable tip shields for light-sensitive and UV-cure adhesives. Tip shields fit over the dispensing tip hub.
Tip Tinner
Plato’s Tip-Tin provides fast, efficient cleaning and re-tinning of highly oxidized soldering iron tips safely and efficiently.
TMT-2000S Soldering & Rework System
The TMT-2000S is based on Curie Heat Technology which responds to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and ...
TMT-5000S Soldering & Rework System
The TMT-5000S is based on Curie Heat Technology which responds to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and ...
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